15–16 Nov 2025
Indian Institute of Science
Asia/Kolkata timezone

eSim on Ubuntu: Open Source EDA and PDKs for Circuit Design with Snap, Docker, and AI

15 Nov 2025, 12:30
35m
Indian Institute of Science

Indian Institute of Science

Bengaluru, India
Talk (30 mins+) Embedded Systems & IoT

Speakers

Mr Sumanto Kar
FOSSEE, IIT Bombay
Mr Aditya Minocha
FOSSEE, IIT Bombay
Ms Shanthi Priya
FOSSEE, IIT Bombay
Mr Varad Patil
FOSSEE, IIT Bombay

Description

eSim on Ubuntu represents a complete open-source ecosystem for electronic design, simulation, and prototyping, combining the flexibility of Ubuntu with the power of modern packaging and deployment tools like Snap and Docker. Developed at FOSSEE, IIT Bombay, eSim integrates schematic capture, circuit simulation using Ngspice and Verilator, mixed-signal support, and PCB workflows through KiCad, providing a unified alternative to costly proprietary EDA tools. With Snap packaging, users benefit from simple installation and seamless updates across Ubuntu versions, while Docker containers ensure reproducibility, portability, and ease of setup for workshops, collaborative research, and cloud environments. The inclusion of open-source Process Design Kits (PDKs) such as SkyWater 130nm, GF180(Work in Progress), and IHP SG13G2 bridges the gap between education and industry by allowing users to take their designs from circuit level to silicon, fostering innovation in open hardware. Looking ahead, the convergence of AI with eSim on Ubuntu opens new possibilities for automated circuit optimization, intelligent design space exploration, and smart error detection, making the design process faster, more efficient, and more accessible. Together, eSim, open-source PDKs, and Ubuntu’s AI-ready ecosystem pave the way for a democratized future in electronics design—one where students, researchers, startups, and industries can all collaborate and innovate without barriers. All the code resource for eSim are available on eSim-GitHub page. We are developing a Cloud version of eSim.

Presentation materials